High-purityClass,CopperSulfatePentahydrate(asCu-10)  High-purityClass,CopperSulfatePentahydrate(asCu-10)Specifications (CuSO4·5H2O)≥ 99% (Cu)≥ 25.2% (Fe)≤ 10ppm (Zn)≤ 10ppm (Pb)≤ 10ppm (Cl)≤ 10ppm (Co)≤ 5 ppm (Ca)≤ 5 ppm (As)≤ 5 ppm (Ni)≤ 5 ppm (Cd)≤ 3 ppm (Water-insolublesubstances)≤ 50ppm (pHvalue,5%solutionat25℃)3.5~4.5 Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPC,Interfinishetc. Package:25KG/BAG Storageinstruction:Avoidheatanddirectsunlight.Storeinacool,drylocation.

ElectroplatingClass,CopperSulfatePentahydrate ElectroplatingClass,CopperSulfatePentahydrate   Specifications (CuSO4·5H2O)≥99% (Cu)≥25.2% (Fe)≤50 ppm (Zn)≤ 50ppm (Ni)≤ 50ppm (Co)≤50ppm (Pb)≤50 ppm (As)≤ 10ppm (Cl)≤100ppm (Water-insolublesubstances)≤100ppm (pHvalue,5%solutionat25℃)3.5~4.5 Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPCetc. Package:25KG/BAG Storageinstruction:Avoidheatanddirectsunlight.Storeinacool,drylocation.

CopperSulfateSolution,forelectroplating CopperSulfateSolution,forelectroplatingSpecifications (CuSO4·5H2O)295~305g/L (Cu)≥75g/L (Mn)≤5mg/L (Fe)≤4mg/L (Zn)≤ 4mg/L (Cl)≤4mg/L (Pb)≤3mg/L (Ca)≤2mg/L (Ni)≤2mg/L (As)≤2mg/L(Densityat25℃)1.17~1.19g/mL (pHvalue at25℃)1.50~2.50  Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPCetc. Package:20L/BARREL;200L/BARREL Storageinstruction:Ifstoredproperlyabove18℃andinitsoriginalbarrel,ithasanindefiniteshelflife.

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