CopperSulfateSolution,forelectroplating CopperSulfateSolution,forelectroplatingSpecifications (CuSO4·5H2O)295~305g/L (Cu)≥75g/L (Mn)≤5mg/L (Fe)≤4mg/L (Zn)≤ 4mg/L (Cl)≤4mg/L (Pb)≤3mg/L (Ca)≤2mg/L (Ni)≤2mg/L (As)≤2mg/L(Densityat25℃)1.17~1.19g/mL (pHvalue at25℃)1.50~2.50  Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPCetc. Package:20L/BARREL;200L/BARREL Storageinstruction:Ifstoredproperlyabove18℃andinitsoriginalbarrel,ithasanindefiniteshelflife.