Copper Sulfate Solution, for Electroplating
Copper Sulfate Solution, for electroplating
Copper Sulfate Solution, for electroplating |
Specifications |
(CuSO4·5H2O) |
295~305 g/L |
(Cu) |
≥ 75 g/L |
(Mn) |
≤ 5 mg/L |
(Fe) |
≤ 4 mg/L |
(Zn) |
≤ 4 mg/L |
(Cl) |
≤ 4 mg/L |
(Pb) |
≤ 3 mg/L |
(Ca) |
≤ 2 mg/L |
(Ni) |
≤ 2 mg/L |
(As) |
≤ 2 mg/L |
(Density at 25℃) |
1.17~1.19 g/mL |
(pH value at 25℃) |
1.50~2.50 |
Applications:
Electronic devices, Electroless Copper Deposition, PCB/FPC etc.
Package:
20 L/BARREL;
200 L/BARREL
Storage instruction:
If stored properly above 18℃ and in its original barrel, it has an indefinite shelf life.
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