Electroplating Class, Copper Sulfate Pentahydrate
Electroplating Class, Copper Sulfate Pentahydrate
Electroplating Class, Copper Sulfate Pentahydrate |
Specifications |
(CuSO4·5H2O) |
≥ 99% |
(Cu) |
≥ 25.2% |
(Fe) |
≤ 50 ppm |
(Zn) |
≤ 50 ppm |
(Ni) |
≤ 50 ppm |
(Co) |
≤ 50 ppm |
(Pb) |
≤ 50 ppm |
(As) |
≤ 10 ppm |
(Cl) |
≤ 100 ppm |
(Water-insoluble substances) |
≤ 100 ppm |
(pH value, 5%solution at 25℃) |
3.5~4.5 |
Applications:
Electronic devices, Electroless Copper Deposition, PCB/FPC etc.
Package:
25 KG/BAG
Storage instruction:
Avoid heat and direct sunlight. Store in a cool, dry location.

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