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Copper Sulfate Solution, for Electroplating
Copper Sulfate Solution, for electroplating
|
Copper Sulfate Solution, for electroplating |
Specifications |
|
(CuSO4·5H2O) |
295~305 g/L |
|
(Cu) |
≥ 75 g/L |
|
(Mn) |
≤ 5 mg/L |
|
(Fe) |
≤ 4 mg/L |
|
(Zn) |
≤ 4 mg/L |
|
(Cl) |
≤ 4 mg/L |
|
(Pb) |
≤ 3 mg/L |
|
(Ca) |
≤ 2 mg/L |
|
(Ni) |
≤ 2 mg/L |
|
(As) |
≤ 2 mg/L |
|
(Density at 25℃) |
1.17~1.19 g/mL |
|
(pH value at 25℃) |
1.50~2.50 |
Applications:
Electronic devices, Electroless Copper Deposition, PCB/FPC etc.
Package:
20 L/BARREL;
200 L/BARREL
Storage instruction:
If stored properly above 18℃ and in its original barrel, it has an indefinite shelf life.
Wuzhou SaintGreen Technology Co,.Ltd
Address : 398, Guangxin Rd, Longwei District, Wuzhou, Guangxi, China
Postcode : 543100
Tel : 86-774-2689882，2693400
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Fax : 86-774-2681837
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