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Copper Sulfate Solution, for Electroplating

Products' details

Copper Sulfate Solution, for electroplating

 

Copper Sulfate Solution, for electroplating

Specifications

 CuSO4·5H2O

295~305 g/L

 Cu

≥ 75 g/L

 Mn

≤ 5 mg/L

 Fe

≤ 4 mg/L

 Zn

≤ 4 mg/L

 Cl

≤ 4 mg/L

 Pb

≤ 3 mg/L

 Ca

≤ 2 mg/L

 Ni

≤ 2 mg/L

 As

≤ 2 mg/L

Density at 25℃

1.17~1.19 g/mL

 pH value at 25℃

1.50~2.50

 

 

Applications:

Electronic devices, Electroless Copper Deposition, PCB/FPC etc.

 

Package:

20 L/BARREL;

200 L/BARREL

 

Storage instruction:

If stored properly above 18℃ and in its original barrel, it has an indefinite shelf life.

 

 

 

 

Corresponding parameter set not found, please add it in property template of background
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