Electroplating Class, Copper Sulfate Pentahydrate

ElectroplatingClass,CopperSulfatePentahydrate ElectroplatingClass,CopperSulfatePentahydrate Specifications (CuSO4·5H2O)≥99% (Cu)≥25.2% (Fe)≤50 ppm (Zn)≤ 50ppm (Ni)≤ 50ppm (Co)≤50ppm (Pb)≤50 ppm (As)≤ 10ppm (Cl)≤100ppm (Water-insolublesubstances)≤100ppm (pHvalue,5%solutionat25℃)3.5~4.5 Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPCetc. Package:25KG/BAG Storageinstruction:Avoidheatanddirectsunlight.Storeinacool,drylocation.

Retail price

0.0

元

Market price

0.0

元

Number of views:

1017

Product serial number

Quantity

Stock:

Category

Back to list



Description

Parameters

电镀级硫酸铜

Electroplating Class, Copper Sulfate Pentahydrate

Electroplating Class, Copper Sulfate Pentahydrate	Specifications
(CuSO₄·5H₂O)	≥ 99%
(Cu)	≥ 25.2%
(Fe)	≤ 50 ppm
(Zn)	≤ 50 ppm
(Ni)	≤ 50 ppm
(Co)	≤ 50 ppm
(Pb)	≤ 50 ppm
(As)	≤ 10 ppm
(Cl)	≤ 100 ppm
(Water-insoluble substances)	≤ 100 ppm
(pH value, 5%solution at 25℃)	3.5~4.5